ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,231, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,232, issued on Aug. 25, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor package having memory devices stacked in s... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,233, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Stacked semiconductor package" was invented ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,234, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method for fabrica... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,235, issued on Aug. 25, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor memory device and manufacturing method of se... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,236, issued on Aug. 25, was assigned to CXMT Corp. (Hefei, China). "Memory chip, logic chip, chip-stacked structure, and memory" was invent... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,237, issued on Aug. 25, was assigned to Hue Inc. (Shanghai). "Slicing micro-LED wafer and slicing micro-LED chip" was invented by Qunchao X... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,238, issued on Aug. 25, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Stacked devices and methods of f... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,239, issued on Aug. 25, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,240, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package structure having inter... Read More